Published!

by NAA

David just had two articles published. You can search for him as an author on the ASME website. Freakin’ sweet.

“Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder,” has been published online today, 31 January 2008, in Journal of Electronic packaging (Vol.130, Iss.1): http://link.aip.org/link/?JEP/130/011002

“Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects,” has been published online today, 31 January 2008, in Journal of Electronic Packaging (Vol.130, Iss.1): http://link.aip.org/link/?JEP/130/011003

published

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